Publikationen

2025

Aslan, Tuğana, Holzapfel, Peter, Stobbe, Lutz, Grimm, Andreas, Nissen, Nils F., Finkbeiner, Matthias: Toward climate neutral data centers: Greenhouse gas inventory, scenarios, and strategies. In: iScience, Volume 28, Issue 1 (2025). DOI: 10.1016/j.isci.2024.111637
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Constantin Baumann (Fraunhofer IIS), Johannes Wieczorek (Fraunhofer IIS), Peter Spies (Fraunhofer IIS), David Sanchez (Fraunhofer IZM): Ermittlung und Vergleich des CO₂-Fußabdrucks von energieautarken Sensorsystemen.
Dieses Whitepaper ist Teil des Projekts „Green ICT @ FMD“ – Kompetenzzentrum für ökologisch nachhaltige Informations- und Kommunikationstechnologie
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2024

Paul S.; Wolff N.; Kuremyr T.; Delepaut C.; Valenta V.; Heinrich W.; Bengtsson O. (2024): A Compact L-Band Reverse-Type Envelope Tracking System. In: Article (IEEE Transactions on Microwave Theory and Techniques). DOI:10.1109/TMTT.2024.3356654.
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Schulze C.; Mengozzi M.; Gibiino G.P.; Angelotti A.M.; Florian C.; Santarelli A.; Heinrich W.; Bengtsson O. (2024): A VNA-Based Wideband Measurement System for Large-Signal Characterization of Multiport Circuits. In: Article (IEEE Transactions on Microwave Theory and Techniques). DOI:10.1109/TMTT.2023.3325105.
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Sica M.; Shariati B.; Jafari A.; Hosl H.; Balanici M.; Fischer J.K.; Freund R. (2024): Energy Consumption Monitoring and CO2 Emissions Estimation in Optical Access Networks: Abstract. In: Conference paper (2024 12th International Workshop on Fiber Optics in Access Networks, FOAN 2024). DOI:10.1109/FOAN63517.2024.10765773.
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Dandekar A.; Wegener J.; Rahman A.; Schulz-Zander J. (2024): Towards Application Level Energy Monitoring for Green 6G Networks. In: Conference paper (5G-MeMU 2024 – Proceedings of the 4th ACM Workshop on 5G and Beyond Network Measurements, Modeling, and Use Cases, Co-Located with: CoNEXT 2024). DOI:10.1145/3694810.3700158.
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Kunnath A.A.; Albahrani S.A.; Schwantuschke D.; Leuther A. (2024): Characterization and Large-Signal Modeling of 4-Pole Backgated InGaAs HEMT. In: Conference paper (2024 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2024). DOI:10.1109/BCICTS59662.2024.10745664.
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Kunnath A.A.; Moulin M.; Albahrani S.A.; Schwantuschke D.; Leuther A. (2024): Exploring Breakdown Voltage Improvement in 20-nm InGaAs-Channel HEMT-OI with Metallic Back-Gate. In: Conference paper (2024 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2024). DOI:10.1109/BCICTS59662.2024.10745682.
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Tessmann A.; Leuther A.; John L.; Massler H.; Piironen P. (2024): High-Gain 664 GHz Low-Noise Amplifier Modules Based on Advanced InGaAs HEMT Technologies. In: Conference paper (2024 19th European Microwave Integrated Circuits Conference, EuMIC 2024). DOI:10.23919/EuMIC61603.2024.10732650.
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Basler M.; Mönch S.; Reiner R.; Benkhelifa F.; Quay R. (2024): Monolithically Integrated GaN Power Stage for More Sustainable 48 V DC–DC Converters. In: Article (Electronics (Switzerland)). DOI:10.3390/electronics13071351.
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Basler M.; Reiner R.; Monch S.; Grieshaber D.; Benkhelifa F.; Quay R. (2024): Monolithically Integrated Two-Stage GaN Gate Drivers. In: Conference paper (2024 IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe, WiPDA Europe 2024). DOI:10.1109/WiPDAEurope62087.2024.10797450.
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Schulze S.; Vob T.; Kruger P.; Wietstruck M. (2024): A Collective Die to Wafer Bonding Approach Based on Surface-Activated Aluminum-Aluminum Thermocompression Bonding. In: Article (IEEE Transactions on Components, Packaging and Manufacturing Technology). DOI:10.1109/TCPMT.2024.3363236.
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Vatanian N.; Oliveira Da Costa G.W.; Roth-Mandutz E.; George G.; Franchi N. (2024): Energy Savings in 5G-Advanced Radio Access Networks: Downlink Signaling Adaptation. In: Conference paper (IEEE Vehicular Technology Conference). DOI:10.1109/VTC2024-Fall63153.2024.10757515.
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Prativadibhayankaram S.; Panda M.P.; Richter T.; Sparenberg H.; Fosel S.; Kaup A. (2024): SLIC: A Learned Image Codec Using Structure and Color. In: Conference paper (Data Compression Conference Proceedings). DOI:10.1109/DCC58796.2024.00008.
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Ingaleshwar S.; Thasharofi F.; Pava M.A.; Vaishya H.; Tabak Y.; Ernst J.; Portas R.; Rast W.; Melzheimer J.; Aschenborn O.; Goetz T.; Goeb S. (2024): Wildlife Species Classification on the Edge: A Deep Learning Perspective. In: Conference paper (International Conference on Agents and Artificial Intelligence). DOI:10.5220/0012376700003636.
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Schischke K.; Proske M.; Sanchez D.; Poppe E.; Lopes S.C. (2024): Advancing The State of Life Cycle Assessments for Computers and Laptops Towards a More Sustainable IT Ecosystem. In: Conference paper (International Conference Electronics Goes Green 2024+: From Silicon to Sustainability, EGG 2024 – Proceedings). DOI:10.23919/EGG62010.2024.10631216.
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Koscielski M.; Stobbe L.; Mager T.; Jokinen T.; Schulz A.; Kiernich A. (2024): ALU4CED – New Concept for Circular Electronic Design Based on Aluminium. In: Conference paper (International Conference Electronics Goes Green 2024+: From Silicon to Sustainability, EGG 2024 – Proceedings). DOI:10.23919/EGG62010.2024.10631210.
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Baur S.-J.; Proske M.; Scholz R.; Boysen G.; Nissen N. (2024): Breaking Down Corporate CO2-Neutrality Commitments: The Example of a Network Switch. In: Conference paper (International Conference Electronics Goes Green 2024+: From Silicon to Sustainability, EGG 2024 – Proceedings). DOI:10.23919/EGG62010.2024.10631197.
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Czymai M.; Eschenbach K.; Hoske R.; Jaeger-Erben M.; Kraft M.; Marwede M. (2024): Citizens Sensing Emissions – First Results of a Citizen Science Project. In: Conference paper (International Conference Electronics Goes Green 2024+: From Silicon to Sustainability, EGG 2024 – Proceedings). DOI:10.23919/EGG62010.2024.10631231.
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Ruckschloss J.; Sanchez D.; Schischke K.; Bregadze S.; Nissen N.F.; Schneider-Ramelow M. (2024): Energy Efficiency Labelling for Computers: How Can Product Groups be Covered?. In: Conference paper (International Conference Electronics Goes Green 2024+: From Silicon to Sustainability, EGG 2024 – Proceedings). DOI:10.23919/EGG62010.2024.10631187.
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Wagner E.; Kegler S.; Gallina V.; Aigner T.; Koller J. (2024): How Industrial Data Meets Information Requirements of the Digital Product Passport – The Case of Remanufacturing Data. In: Conference paper (International Conference Electronics Goes Green 2024+: From Silicon to Sustainability, EGG 2024 – Proceedings). DOI:10.23919/EGG62010.2024.10631243.
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Poppelaars, Flora; Azad, Andishehsadat (2024): Improving Collection by Designing Valuable Consumer Experiences: First Lessons from Practice Theory. In: Conference paper (International Conference “Electronics Goes Green 2024+”, EGG 2024. Proceedings). DOI:10.23919/EGG62010.2024.10631213.
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Proske M.; Billaud M.; Clemm C.; Sanchez D.; Lorf Y.; Stobbe L. (2024): Investigation of Semiconductor Die Area as a Reference Variable for LCA. In: Conference paper (International Conference Electronics Goes Green 2024+: From Silicon to Sustainability, EGG 2024 – Proceedings). DOI:10.23919/EGG62010.2024.10631237.
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Goldbrunner J.; Scherbaum S.; Yacoub E.; Faghih M.; Tinku S.; Proske M.; Baur S.-J. (2024): LEO – Innovative Metallization and Patterning Process on Flexible Substrates. In: Conference paper (International Conference Electronics Goes Green 2024+: From Silicon to Sustainability, EGG 2024 – Proceedings). DOI:10.23919/EGG62010.2024.10631224.
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Elsotohy M.; Dobs T.; Jaeschke J.; Sehr F. (2024): Lifetime Prediction Strategy for Electronic Systems to Enhance Environmental Sustainability. In: Conference paper (International Conference Electronics Goes Green 2024+: From Silicon to Sustainability, EGG 2024 – Proceedings). DOI:10.23919/EGG62010.2024.10631217.
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Stobbe L.; Nissen N.; Proske M.; Schulz A.; Aslan T. (2024): Methodical Challenges of Prognostic Lifecycle Assessment – an Exemplary Study of ICT’s Environmental Impact in Germany 2030. In: Conference paper (International Conference Electronics Goes Green 2024+: From Silicon to Sustainability, EGG 2024 – Proceedings). DOI:10.23919/EGG62010.2024.10631248.
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Ebert T.; Jayanathan S.; Cuccaro L.; Guzzo R.; Schischke K.; Sanchez D. (2024): Product Design Strategies for Decarbonization and Resource Efficiency. In: Conference paper (International Conference Electronics Goes Green 2024+: From Silicon to Sustainability, EGG 2024 – Proceedings). DOI:10.23919/EGG62010.2024.10631260.
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Tochtrop C.; Von Geibler J.; Ruckschloss J.; Schlegel M.-C. (2024): Product Features: Upgraded Functionality or Sustainability Problem? An Environmental Assessment Approach for Additional Product Functions and Its Application in the Case of Fridge-Freezers. In: Conference paper (International Conference Electronics Goes Green 2024+: From Silicon to Sustainability, EGG 2024 – Proceedings). DOI:10.23919/EGG62010.2024.10631252.
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Parajuly K.; Green J.; Richter J.; Johnson M.; Rückschloss J.; Peeters J.; Kuehr R.; Fitzpatrick C. (2024): Product repair in a circular economy: Exploring public repair behavior from a systems perspective. In: Article (Journal of Industrial Ecology). DOI:10.1111/jiec.13451.
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Fritsch A.; Bauer L.; Dittrich F.; Graf D.; Schischke K.; Teusch C. (2024): Scope 3 Data in Electronics Supply Chains: How to Address Common Challenges and Pitfalls. In: Conference paper (International Conference Electronics Goes Green 2024+: From Silicon to Sustainability, EGG 2024 – Proceedings). DOI:10.23919/EGG62010.2024.10631250.
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Clemm C.; Stobbe L.; Wimalawarne K.; Druschke J. (2024): Towards Green AI: Current Status and Future Research. In: Conference paper (International Conference Electronics Goes Green 2024+: From Silicon to Sustainability, EGG 2024 – Proceedings). DOI:10.23919/EGG62010.2024.10631247.
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Hölck O.; Voges S.; Becker K.-F.; Wagner E.; Schneider-Ramelow M. (2024): Why Should We Share Material Data? The Positive Impact of Public/Private Databases Access Through Digital Twins Along the Product Value Chain. In: Conference paper (International Conference Electronics Goes Green 2024+: From Silicon to Sustainability, EGG 2024 – Proceedings). DOI:10.23919/EGG62010.2024.10631220.
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2023

Mengozzi, M., Gibiino, G.P., Angelotti, A.M., Florian, C., Santarelli, A., Schulze, C., Bengtsson, O. (2023): Modulated-Input Control and Linearization of a Multi-Port Millimeter-Wave PA by VNA-based Calibrated Wideband Measurements. In: 101st ARFTG Microwave Measurement Conference: Challenges in Complex Measurement Environments, ARFTG 2023 (Conference Paper).
DOI:10.1109/ARFTG57476.2023.10279176.
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Reiner, Richard; Basler, Michael; Mönch, Stefan; Waltereit, Patrick; Benkhelifa, Fouad; Mikulla, Michael; Quay, Rüdiger (2023): Lateral GaN Power Devices and Integrated GaN Power Circuits: Status and Recent Progress. In: Bauelemente der Leistungselektronik und ihre Anwendungen 2023 (Conference Paper).
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Basler, M., Deneke, N., Monch, S., Reiner, R., Wicht, B., Quay, R. (2023): Monolithically Integrated GaN Gate Drivers- A Design Guide (2023). In: IEEE Open Journal of Power Electronics (Article). DOI:10.1109/OJPEL.2023.3290190.
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Trenz, A., Hoffmann, C., Lange, C., Öchsner, R. (2023): Increasing Energy Efficiency and Flexibility by Forecasting Production Energy Demand Based on Machine Learning. In: Lecture Notes in Mechanical Engineering (Conference Paper). DOI:10.1007/978-3-031-28839-5_50
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Maisel, F., Neef, C., Marscheider-Weidemann, F., Nissen, N.F. (2023): A forecast on future raw material demand and recycling potential of lithium-ion batteries in electric vehicles. In: Resources, Conservation and Recycling (Article). DOI:10.1016/j.resconrec.2023.106920.
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Deutsches Institut für Normung e.V. (2023): Deutsche Normungsroadmap Circular Economy. In: (Report).
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Amatuni, L., Yamamoto, T., Baldé, C.P., Clemm, C., Mogollón, J.M. (2023): Quantifying total lifetimes of consumer products: Stochastic modelling accounting for second-hand use and establishing an open-collaborative database. In: Resources, Conservation and Recycling (Article). DOI:10.1016/j.resconrec.2023.107103.
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Schischke, K., Ruckschloss, J., Schlegel, M.-C., Zollinger, J., Nissen, N.F., Schneider-Ramelow, M. (2023): The European Union’s Energy Label for Smartphones: Does it Guide Consumers to Make Environmentally Sustainable Choices?. In: IEEE International Conference on Consumer Electronics – Berlin, ICCE-Berlin (Conference Paper). DOI:10.1109/ICCE-Berlin58801.2023.10375619.
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Voigt, S., Willert, A., Mende, W., Zschau, T., Oehme, T., Zichner, R. (2023): Environmental friendly and low cost monitoring system for plant and agriculture fields. In: 2023 Smart Systems Integration Conference and Exhibition, SSI 2023 (Conference Paper). DOI:10.1109/SSI58917.2023.10387957.
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Helke, C., Reinhardt, M., Arnold, M., Schwenzer, F., Haase, M., Wachs, M., Goßler, C., Götz, J., Keppeler, D., Wolf, B., Schaeper, J., Salditt, T., Moser, T., Schwarz, U.T., Reuter, D. (2023): On the Fabrication and Characterization of Polymer-Based Waveguide Probes for Use in Future Optical Cochlear Implants. In: Materials (Article). DOI:10.3390/ma16010106.
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2022

Shivan T., Hossain M., Doerner R., Yacoub H., Snyder B., Tegegne Z., Deumer M., Nellen S., De Felipe Mesquida D., Heinrich W., Krozer V. (2022): A Wideband Ultra-Low Current Noise Transimpedance Amplifier for Ultrafast Wideband THz Communication. In: 2022 24th International Microwave and Radar Conference, MIKON 2022 (Conference Paper).
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Sweke R., Boes P., Ng N., Sparaciari C., Eisert J., Goihl M. (2022): Transparent reporting of research-related greenhouse gas emissions through the scientific CO2nduct initiative. In: Communications Physics, Vol. 5, Nr. 1, Art. 150 (Note). DOI:10.1038/s42005-022-00930-2.
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Powroźnik P., Szcześniak P., Sobolewski Ł., Piotrowski K. (2022): Novel Functionalities of Smart Home Devices for the Elastic Energy Management Algorithm. In: Energies, Vol.15, Nr.22, Art.8632 (Article). DOI:10.3390/en15228632.
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Szcześniak P., Turchan K., Krysik M., Koropiecki I., Piotrowski K. (2022): An Elastic Energy Management Algorithm in a Hierarchical Control System with Distributed Control Devices. In: Energies, Vol.15, Nr.13, Art.4750 (Article). DOI:10.3390/en15134750.
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Panic G., Krstic M. (2022): Designing a Power Efficient Sensor Node Microcontroller. In: IFAC-PapersOnLine, Vol.55, Nr.4, pp.298-303 (Conference Paper). DOI:10.1016/j.ifacol.2022.06.049.
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Mesogiti I., Theodoropoulou E., Setaki F., Lyberopoulos G., Moscateli F., Kanta K., Giannoulis G., Toumasis P., Apostolopoulos D., Avramopoulos H., Lopacinski L., Teran J.G., Nanos A., Leiba Y., Anastasopoulos M., Tzanakaki A. (2022): Advancements in Edge Computing and Service Orchestration in Support of Advanced Surveillance Services. In: IFIP Advances in Information and Communication Technology, Vol.652 IFIP, pp.53-60 (Conference Paper). DOI:10.1007/978-3-031-08341-9_5.
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Krysik M., Piotrowski K., Turchan K. (2022): Testing Smart Grid Scenarios with Small Volume Testbed and Flexible Power Inverter. In: Energies, Vol.15, Nr.2, Art.428 (Article). DOI:10.3390/en15020428.
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Powroźnik P., Szcześniak P., Piotrowski K. (2022): Elastic energy management algorithm using iot technology for devices with smart appliance functionality for applications in smart-grid. In: Energies, Vol.15, Nr.1, Art.109 (Article). DOI:10.3390/en15010109
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Popp J., Robert J., Roth-Mandutz E., Heuberger A. (2022): Impact of Access Barring Schemes for Delay Tolerant MTC Devices on Energy Consumption. In: IEEE Vehicular Technology Conference, Vol. 2022-June (Conference Paper). DOI:10.1109/VTC2022-Spring54318.2022.9860483.
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Sabih M., Mishra A., Hannig F., Teich J. (2022): MOSP: Multi-Objective Sensitivity Pruning of Deep Neural Networks. In: 2022 IEEE 13th International Green and Sustainable Computing Conference, IGSC 2022 (Conference Paper). DOI:10.1109/IGSC55832.2022.9969374.
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Brockmann C., Al-Magazachi S., Rezaei A., Hefer J., Hager J., Gerstner H., Matlok S., Eckardt B., Eppel M., Milosiu H., Oehler F. (2022): Modular Ultra-Low-Power IoT-Core-Bridging the Gap Between Power Electronics and Distributed Sensor Networks. In: PCIM Europe Conference Proceedings, pp. 37-42 (Conference Paper). DOI:10.30420/565822008.
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Ahmed M., Dankwort T., Grünzig S., Lange V., Gojdka B. (2022): Broadband Zero-Power Wakeup MEMS Device for Energy-Efficient Sensor Nodes. In: Micromachines, Vol. 13, Nr. 3, Art. 407 (Article). DOI:10.3390/mi13030407.
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Schischke K., Berwald A., Dimitrova G., Rückschloss J., Nissen N.F., Schneider-Ramelow M. (2022): Durability, reparability and recyclability: Applying material efficiency standards en 4555x to mobile phones and tablet computers. In: Procedia CIRP, Vol. 105, pp. 619-624 (Conference Paper). DOI:10.1016/j.procir.2022.02.103.
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Proske M. (2022): How to address obsolescence in LCA studies – Perspectives on product use-time for a smartphone case study. In: Journal of Cleaner Production, Vol. 376, Art. 134283 (Article). DOI:10.1016/j.jclepro.2022.134283.
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Marscheider-Weidemann Frank, Langkau Sabine, Eberling Elisabeth, Erdmann Lorenz, Haendel Michael, Krail Michael, Loibl Antonia, Neef Christoph, Neuwirth Marius, Rostek Leon, Shirinzadeh Saeideh, Stijepic Denis, Tercero Espinoza Luis Alberto, Baur Sarah-Jane, Billaud Mathilde, Deubzer Otmar, Maisel Franziska, Marwede Max, Rückschloss Jana, Tippner Max (2022): Raw materials for emerging technologies 2021. In: 346 S. (Report)
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J. Rückschloss, K. Schischke, A. Berwald, M.-C. Schlegel (2022): Pandemic-related behavioural changes – does EU Ecodesign policy making need to react?. In: eceee Summer Study Proceedings
2022, Hyères, France, ISBN: 978-91-988270-1-9 (Article).
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