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Microelectronics production
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Communication infrastructures
Carbon Footprint von III-V Halbleitern
[2]
CO₂-Bilanz von Kommunikationsinfrastrukturen
[5]
Energieeinsparung bei Servern
[1]
Measured data on energy consumption
[11]
Microelectronics production
CO₂-Bilanz eines Fertigungsprozesses
[6]
CO₂-Einsparung eines Fertigungsprozesses
[1]
Saving on chemicals
[5]
Saving of gases
[1]
Saving energy in the cleanroom infrastructure
[5]
Energieverbrauch eines Fertigungsprozesses
[1]
Substitution of chemicals
[4]
Sensor edge cloud systems
CO₂-Bilanz von Sensoren-Modulen-Systemen
[13]
Energieeinsparung von Sensoren-Modulen-Systemen
[1]
Optimierung von Systemen
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Data sets:
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Energieverbrauch einer Molybdän-Ätzung (Plasma-Ätz)
Hochintegrierter 350-V-Flyback-Wandler für u-Pump-Anwendungen
Energieoptimierter Aluminium-Aluminium Waferbondprozess
Dummy Dispense
TMAH Reduzierung
Al Etching (Aluminium-Ätzung, nass)
LP-CVD Anlage
Stealth Dicing für MEMS und MOEMS
NMP (N-Methyl-2-pyrrolidon) – Ersatz
Umweltpotenzialanalyse zum Einsatz eines innovativen Screeningtools in der Halbleiterfertigung auf Wafer-Level
Energy supply for cleanrooms: PV system (variation of battery parameters)
Energy supply for cleanrooms: peak load reduction
Energy supply for clean rooms: PV system (variation of PV output)
Green stripper for photoresist removal (TMAH replacement)
D-BOS 390 as replacement for EKC265 at TSV Post Etch Cleaning
Photoresist-free, semi-additive manufacturing process for flex (film) conductor tracks
TC-CA25 as a replacement for EKC265 as a metal post-etch for wafer cleaning
Replacement of critical etching chemicals (TMAH)
Photoresist-based semi-additive manufacturing process for flex (film) conductor tracks
Optimization of NF3 chamber cleaning of a PECVD system
Further databases
