We examine your microelectronics production and develop proposals to reduce your CO2e footprint. Apply for a validation project and have your innovative manufacturing process checked right through to the product free of charge!
Optimization of individual processes in terms of energy and material consumption
Sustainable design and connection technology
Replacement of critical materials (CMR and/or PFAS materials)
Focus topics:
Consideration in operation: energy savings in selected scenarios
Consideration of the resource input during production by determining the CO2e footprint (if information is available for the calculation or assessment).
We offer to carry out a life cycle assessment for your manufacturing processes.
The validation project's result is presented as a case study (theoretical consideration), which illustrates the savings potential through Green ICT technology. The final results are also published. Company-specific data will be treated confidentially on request.
What we offer
Reconditioning of carrier wafers
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Cleaning process for 300mm glass wafers for multiple reuse of glass wafers
Reduction of glass wafer scrap and thus of CO2-Emmissionen
New cleaning methods in wet chemistry
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EKC265 substitution for cleaning TSV according to Bosch process
Use of solvents or solvent mixtures that are not carcinogenic and not very harmful to aquatic organisms
FEOL Thermal processing
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Replacement of traditional batch furnace processes by rapid thermal processing in the field of high-quality oxides (e.g. gate oxidation) for the production of complex technologies
Evaluation of material and energy consumption for technology modules using furnace oxides
Metal-metal bonding processes
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Use of hybrid integration based on Al-Al wafer bonding in the MPW range, production of hybrid technologies with optimized performance-cost-trade-off
Evaluation of material and energy consumption for entire technology processes in terms of consumption vs. expenditure
EKC replacement for post-metal etch remover
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Introduction of more environmentally friendly alternatives than EKC265 for cleaning
Fluorides, amines, hydroxylamine and pyrocatechol-free, low process temperature, without rinsing with isopropanol
Optimization of consumption CMP
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Process optimization with slurries from less critical sources or materials, advice on recycling tools, characterization on test structures
Replacement of Ce- by SiO2-containing slurries; reduction of water consumption in the post-process, recycling and re-use of slurries, determination of consumption and CO2-equivalents
Footprint creation in photolithography
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Creation of the IN/OUT material and energy flows of a coater and developer in an industrial environment
Process-dependent CO2-balancing and optimization
PECVD Clean mit Fluorgasmischung (FAN = F<sub>2</sub>/Ar/N<sub>2</sub>)
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Advice on FAN gas installation, creation and optimization of the plasma cleaning recipe
Complete replacement of climate-damaging cleaning gases (C2F6 und NF3) through FAN gas
Integrated scrubber system incl. analysis and treatment of harmful gases
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Harmful gases, investigation of PECVD cleaning processes. Available cleaning gases: PFCs, SF6, NF3, FAN
Processes with the lowest possible amount of wash water or lowest possible propane gas flow
Energy management
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Balancing of processes that are linked to energy quantities, including optimization
Life cycle assessment of specific oxides possible
Optimizing the media savings of tools in semiconductor production
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Consulting on energy efficiency when using machines and systems. With mobile energy loggers, the electrical parameters can be recorded with time resolution and correlated directly with running processes
Depending on the initial situation, tool-dependent energy savings of up to 25 % can be achieved. Measurements allow life cycle assessment of individual processes
Process parameters for the production of InGaAs/InAlAs/InP heterostructures on silicon substrates
Reduction of the arsenic content in electronic high-frequency circuits by 99.99 %
NMP replacement
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Alternative NMP substances with advantages and disadvantages have been tested. These tests can be extended by extensive knowledge of characterizations.
