Since September 2024:
intelligent fluids GmbH
The aim is to evaluate an environmentally friendly, water-based alternative to the petroleum-based solvent processes currently used in the semiconductor industry.
HyPhoX GmbH
The overarching goal of the project is to significantly reduce the CO2 footprint during chip and system production and during the utilization phase of digital rapid tests.
LIDROTEC GmbH
The aim is to reduce the ecological footprint by increasing energy and resource efficiency in the separation of electronic components for high-power applications.
Since January 2024:
DIVE imaging systems GmbH
The company DIVE imaging systems GmbH is supported by Fraunhofer IPMS for the integration of its innovative solder-based inspection tool.
XCCES GmbH
XCCES GmbH is working with Fraunhofer IZM to evaluate the reliability and optimization of its innovative soldered joints.